CI4SPL 2018

1st International Workshop on Computational Intelligence for Software Product Lines
11 September 2018, Gothenburg, Sweden
held in conjunction with SPLC2018 - 22nd International Software Product Line Conference - Sept 10-14 2018


An increasing number of researchers from the Software Product Line (SPL) discipline are solving complex problems by applying Computational Intelligence (CI) techniques, such as Machine Learning (ML) and search-based ones. This last field known as Search-Based Software Engineering (SBSE). It is natural to think of many SPL related problems as optimization problems. SPLs are generally associated to numerous features, which are generally combined through complex relations to derive individual systems that need to be efficiently designed, implemented and managed, involving activities such as reuse, traceability of requirements into products, testing, maintenance and evolution. In addition to this, search-based techniques and data mining can help with the decision making process based on information collected during the development and application repositories, as well as with automation and generation of artifacts. Given the context provided above, we present the first edition of CI4SPL 2018. The workshop aims at bring together both theoretical development and application of CI paradigms to Software Product Line Engineering (SPLE). The main focus is on SBSE and ML techniques, but all CI paradigms are welcome.

Important dates

Paper submissions: May 23, 2018 May 30, 2018 (extended)
Paper notifications: Jun 22, 2018
Final version of papers: July 2, 2018
CI4SPL 2018 Workshop: 11 September 2018
SPLC 2018 Conference: 10-14 September 2018


The topics of interest include application of different CI techniques from throughout the SPL engineering process. The figure below presents some topics, but are not limited to. The development of SPLs faces complex problems such as large artifacts, many products, implicit or partially incomplete information, many domain constraints, non- functional restrictions, huge number of features, etc. The solutions for these problems are not simple or trivial, being a promising field for application of CI techniques.

We strongly encourage papers that not only apply a technique, but also present results from their theoretical analysis and empirical evaluation, as well as, reports of industrial experiences.

Submission details

CI4SPL proceedings will be included in SPLC proceedings (Volume 2)

Submission types: Authors interested in participating in the workshop are requested to submit either:

  • Regular paper (max. 8 pages) that presents original research or industrial experience report
  • Position/Short paper (max. 4 pages) that describes sound new ideas and concepts that are under research or experimental studies at industrial settings.

Format: Submissions should use the ACM SIG proceedings format in the same way as for the SPLC conference proceedings.
Templates for Word and LaTeX are available at
Latex users are indicated to use the "sigconf" option, so they are recommended to use the template that can be found in "sample-sigconf.tex". In this way, the following latex code can be placed at the start of the latex document: \documentclass[sigconf]{acmart} \acmConference[SPLC'18]{22nd International Conference on Software Product Line}{10--14 September, 2018}{Gothenburg, Sweden}

Submission: All papers submitted to the workshop must be unpublished original work and must not have been submitted anywhere else for publication. Each paper will be reviewed by three PC members and accepted papers will be selected based on quality, novelty, and relevance to the workshop topic. Papers should be submitted via

Program Committee

  • Eduardo Figueiredo - Federal University of Minas Gerais, Brazil
  • Francisco Chicano - University of Malaga, Spain
  • Gilles Perrouin - University of Namur, Belgium
  • Ivan do Carmo Machado - Federal University of Bahia, Brazil
  • Jabier Martinez - Tecnalia, Spain
  • Maxime Cordy - University of Namur, Belgium
  • Paul Temple - University of Rennes and IRISA lab, France
  • Shaukat Ali - Simula Research Laboratory, Norway
  • Tewfik Ziadi - Universite Pierre et Marie Curie at Paris, France
  • Thelma Elita Colanzi - State University of Maringá, Brazil
  • Xavier Devroey - Delft University of Technology, The Netherlands



Lindholmen Conference Centre
Lindholmspiren 5, Gothenburg, Sweden